Printed circuit boards are inseparable from adhesives, whether they are rigid or flexible.

For epoxy-glass panels, acetal-phenolic, butyronitrile-phenolic or modified epoxy can be used, and the maximum use temperature is about 150°C. When used at a high temperature of 260°C, glass-silicone laminate or copper/PTFE composite board should be used. The laminated assembly of rigid printed circuit boards can be bonded together with plastic films coated with thermoplastic or thermosetting adhesives.

Sometimes complex assembly parts require thin, flexible printed circuits. In this case, RTV silicone rubber coating is used, which can not only be used as an insulating coating, but also can reduce vibration. This vibration will increase undesirable on the welded joints. Fatigue load.

In addition, epoxy glue and organic silica gel are coated on the stressed components to reduce the impact of shock and vibration.