It is suitable for insulation and waterproofing of electronic accessories with high power and high heat dissipation requirements. It can be cured by heating at room temperature, the higher the temperature, the faster the curing speed.
Addition of silicone potting glue
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Product information] HY585 potting sealant is a two-component addition molding silicone thermal conductive potting sealant, suitable for insulation and waterproofing of electronic accessories with high power and high heat dissipation requirements. It can be cured at room temperature or heated. The higher the temperature, the faster the curing speed. This product does not produce any by-products in the curing reaction, and can be applied to metal surfaces and materials such as PC, PP, ABS, and PVC. Fully meet the requirements of the EU ROHS directive.
HY585N Adhesive thermal conductive adhesive: suitable for various thermally conductive sealing and pouring bonding of electronic components.
HY585Z flame-retardant thermal conductive adhesive: suitable for various flame-retardant thermal conductive sealing and pouring bonding of electronic components.
HY585D high thermal conductivity potting glue: suitable for high thermal conductivity sealing and pouring bonding of electronic components.
HY585T transparent potting glue: suitable for casting and bonding with transparency requirements.
Packing Specification： 20KG/set
