One-component organic silicon thermal conductive adhesive Used for filling and bonding between CPU and radiator, thyristor smart module and radiator, high-power electrical module and radiator.
One-component silicone thermal conductive adhesive
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product information 】
Single-component neutral silicone material, instead of thermal grease, used for filling and bonding between CPU and heat sink, thyristor smart module and heat sink, and high-power electrical module and heat sink. Grades
HY595D,
HY595HD,
HY595H silicone rubber thermal conductive glue, white, thixotropic paste, no flow on the facade.
【Product performance】
Density (g/cm3) 1.3～1.7
Dry time (min) 20-40
Tensile strength (MPa) 1.5～2.5
Extension rate (%) 200~300
Shore hardness (Shore A) 30-50
Shear strength (MPa) 1.5～2.5
Dielectric strength (kv/mm) 20
Loss factor (@60Hz) 0.001
Volume resistance (Ω•cm) 2×1014
Operating temperature range (℃) -60～280
Line shrinkage rate (%) 0.5
Thermal conductivity (W/M•K) 0.8~1.0 1.2~1.5 2.0~2.2
【Packing specifications】 100ml/tube, 100 tubes/box
